ETD-900M 型离子溅射仪外观亮丽做工精致磁控溅射是物理气相沉积（Physical Vapor Deposition，PVD）的***种。***般的溅射法可被用于制备金属、半导体、绝缘体等多材料，且具有设备简单、易于控制、镀膜面积大和附着力强等优点，磁控溅射法更是实现了高速、低温、低损伤。因为是在低气压下进行高速溅射，必须有效地提高气体的离化率。磁控溅射通过在靶阴极表面引入磁场，利用磁场对带电粒子的约束来提高等离子体密度以增加溅射率。

      配有高位定性的飞跃真空泵

 The ETD-900M ion sputtering apparatus has beautiful appearance ａnd exquisite workmanship.

  Magnetron sputtering is a kind of Physical Vapor Deposition (PVD). The general sputtering method can be used to prepare materials such as metal, semiconductor, insulator ａnd so on. It has the advantages of simple equipment, easy control, large coating area ａnd strong adhesion. The magnetron sputtering method has achieved high speed, low temperature ａnd low damage. Because of the high velocity sputtering at low pressure, the ionization rate of gas must be increased effectively. Magnetron sputtering improves the plasma density by increasing the plasma density by introducing magnetic field on the cathode surface ａnd confining the charged particles by magnetic field.电话：15321330672

High qualitative jump vacuum pump

ETD-900M磁控溅射仪具有低温快速的优点

需要镀膜的样品