16014

导电银环氧树脂膏， H20E Epo-Tek®， 28.35g

瓶
           

*Color:  Part   A: Silver  Part B: Silver

Weight Loss:

*Consistency:    Smooth, thixotropic paste

@ 200°C: 0.59%

*Viscosity (@ 100 RPM/23°C):  2,200 – 3,200 cPs

@ 250°C: 1.09%

Thixotropic   Index: 4.63

@ 300°C: 1.67%

*Glass Transition Temp.(Tg):  ≥ 80°C  (Dynamic Cure

Operating Temp:

20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min)

Continuous:  -55°C to 200°C

Coefficient of   Thermal Expansion (CTE):

Intermittent:  -55°C to 300°C

Below Tg:  31 x 10-6   in/in/°C

Storage Modulus @   23°C:  808,700 psi

Above Tg:  158 x 10-6   in/in/°C

Ions:  Cl -     73 ppm

Shore D Hardness: 75

Na+      2 ppm

Lap Shear Strength @   23°C:  1,475 psi

NH4+    98 ppm

Die Shear Strength @   23°C:  > 10 Kg / 3,400 psi

K+        3 ppm

Degradation   Temp. (TGA): 425°C

*Particle Size: ≤ 45 Microns

Electrical   Properties:

*Volume Resistivity @ 23°C:  ≤ 0.0004 Ohm-cm

Thermal   Properties:

Thermal   Resistance: (Junction to Case)

Thermal   Conductivity: 2.5 W/mK

Based   on standard method:  Laser Flash

TO-18 package with nickel-gold metallized 20 x 20   mil chips ａnd bonded with EPO-TEK®   H20E (2 mils thick)

Thermal   Conductivity: 29 W/mK

Based   on Thermal Resistance Data: R = L x K-1 x A-1

EPO-TEK®   H20E:  6.7 to 7.0°C/W

Solder:               4.0 to 5.0°C/W