产品详情

AZ 1500 Series Standard Photoresists

GENERAL INFORMATION

This series of positive photoresists actually consists of three different products. They all contain the same photoactive compound (PAC) which responds to the whole UV-spectrum from 310 - 440 nm covering the three main mercury lines, i, h ａnd g. They may be used with broadband as well as monochromatic exposure. Different novolak resins or fractions thereof were chosen to adopt them for different demands, this is indicated by a corresponding suffix of the product designation:

AZ 1500 (no suffix) is the most popular family ａnd a direct safer solvent (PGMEA) substitute for AZ 1370, AZ 1470 , AZ 1350J, AZ 1450J, AZ 1375. It is available in different viscosities to cover the coating thickness range from 0.5 to 4.0 µm. Due to the slightly lower evaporation rate of the PGMEA(compared to cellosolve acetate based solvent system) these resists will show about 5 - 10% higher photospeed which may be compensated by increasing prebake temperature about 5°C. This resists may be used for wet- ａnd dry-etch ａnd cover all demands for general semiconductor manufacturing ａnd other applications with resolution down to 1 µm.

AZ 1514 H is the safer solvent substitute for the well known AZ 1350 H which is now almost 25years old ａnd intended for contact ａnd proximity printing. For this application a low photospeed for better control of exposure (about 10s at 15 mW/cm²) ａnd thus a forgiving resist is the best choice. For many years the "non safe solvent" counterparts AZ 111 S ａnd AZ 1350 H have been the standard resists for making semiconductors, AZ 111 S for wet-etch of oxides, AZ 1350 H for aluminium ａnd nitride etch.

AZ 1500 HS family was developed in 1990. The background for this development was the fact that in making discrete ａnd bipolar semiconductor devices wet-etching is still very common. For wet-etching adhesion is the most important issue. Especially on aluminium the mousebite-phenomenon is well known. To solve this problem we have chosen a low molecular weight novolak resin fraction resulting in significantly improved adhesion ａnd also very high photospeed (therefore the suffix High Speed). Meanwhile AZ 1500 HS has proven its superior performance in several production lines ａnd lead to less rework ａnd higher yields.

All AZ 1500-series resists are compatible with all common developers used for positive photoresists, like AZ 351B (diluted 1:4), 0.5% NaOH solution ａnd metal ion free developers like AZ 726MIF. While AZ 1500-family ａnd AZ 1514H are optimised for best process latitude at 50 - 60 seconds development time, AZ 1500HS-family performs best at 20 - 30 seconds development time resulting in a high throughput lithographic process.

PHYSICAL ａnd CHEMICAL PROPERTIES

FILM THICKNESS [µm] as FUNCTION of SPIN SPEED (characteristically)

PROCESSING GUIDELINES

HANDLING ADVISES

Consult the Material Safety Data Sheets provided by us or your local agent!

This AZ Photoresists are made up with our patented safer solvent PGMEA. They are flammable liquids ａnd should be kept away from oxidants, sparks ａnd openflames.

Protect from light ａnd heat ａnd store in sealed original containers between 0°C ａnd 25°C, exceeding this range to -5°C or +30°C for 1 week does not adversely affect the properties.

Shelf life is limited ａnd depends on the resist series. The expiration date is printed on the label of every bottle below the batch number ａnd coded as [year/month/day].

AZ Photoresists are compatible with most commercially available wafer processing equipment.

Recommended materials include PTFE, stainless steel ａnd high-density poly-ethylene ａnd -propylene.