德国Fraunhofer IZM  
弗劳恩霍夫协会可靠性和微集成研究所多设备集成部于1998 年成立于德国萨克森地区的开姆尼斯市。基础领域是微（纳米）机电系统(MEMS) 的开发、在硅片和其他材料上制造微机电系统的技术和设备。未来，该部门还将研究应用于未来微电子、纳米电子、印刷电子系统的后段制程技术，这一技术将普遍降低智能系统的应用成本，检验智能系统的微观可靠性和纳米可靠性。不久的将来，该系统将具有更多的功能，例如：运用硅技术或非硅技术将信号传输过程、信息传输过程中的电子与传感器、制动器整合在一起。我们的理念就是让所谓的多设备集成系统越来越小。
主要研究活动：
设计、开发微机电系统
● 微机电系统设计、成型
● 传感器、制动器、电子（例如：加速传感器、回转仪、扫描仪）
● 变频器、分析器（即：分光计、超声）
● 测量和表征
后段制程(BOEL)
● 旋布绝缘层、气隙结构、低介电值集成
● 铜互连镀金属设备（例如：45 纳米间距）、扩散障碍层
● 尺寸缩小带来的影响、可靠性、成型和仿真
高级技术开发
● 3D 成型、深硅刻蚀、引线合键、硅片键合、晶片键合技术
● 化学机械抛光
● 微机电系统晶圆级封装
微系统可靠性和纳米可靠性
● 微系统可靠性，如：汽车制造领域和IT 领域内的微系统可靠性
● 可靠性、小型化与微型安全的结合
● 热机仿真和纳米可靠性
The department Multi Device Integration was founded in 1998 and is located in Chemnitz,
Saxony. Its basic fields are the development of Micro-(Nano)-Electro-Mechanical-Systems
(MEMS), technologies and equipment for manufacturing MEMS in silicon and other
materials. Further research fields are back-end-of-line technologies for future micro and nano
electronics, printed electronic systems for ubiquitous low-cost applications and investigation
of micro and nano reliability for smart systems. In near future Microsystems will be quite
more multifunctional e. g. the integrated combination of electronics for signal and information
processing with sensors and actuators in silicon and nonsilicon technologies. The so called
multi device integration to smaller and smarter systems is our vision.
Main Research Activities:
Design and Development of MEMS
● MEMS design and modelling
● Sensors, actuators, and electronics (e. g. acceleration sensors, gyroscopes, scanner)
● Transducer and analyzer systems (i. e. spectrometer, ultra sonic)
● Measurement and characterization
Back-End-of-Line BEOL
● Spin-on dielectrics, Air Gap structures, and integration of low-k dielectrics
● Copper interconnect metallization systems (e.g. 45nm pitches) and diffusion barriers,
● Scaling effects, reliability, modelling and simulation
Development of Advanced Technologies
● 3D-patterning, deep silicon etching and wire, chip and wafer bonding technologies,
● Chemical mechanical planarization (CMP)
● MEMS Packaging at wafer level
Micro and Nano Reliability
● Reliability for Microsystems e. g. for Automotive and IT applications
● Combination of Reliability, Miniaturization and Microsecurity
● Thermomechanical Simulation and Reliability for Nanoelectronics
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总部
Fraunhofer IZM
Chemnitz Branch of the Institute
Multi Device Integration
Reichenhainer Strasse 88
D-09126 Chemnitz