TF500/TF600 适合研发和试生产的全功能系统

HHV TF500及TF600系统设计具有高***工艺能力。系统配置可选择多种腔室尺寸和工艺附件，以精确的符合用户需求。这两个型号的系统都可以安装多个镀膜源，也都支持离子束处理选项。有***系列预进样室（Load Lock）和样品操纵装置可供选择，以提高真空镀膜效率。

系统配置不锈钢真空腔室，高真空泵安装在腔室后方。工艺附件布局采用特殊设计，向每个客户提供满意适配化的方案。工艺附件包括热阻及电子束蒸发源、直流及射频溅射源、用于工件刻蚀或辅助沉积的离子源。系统可以同时配置热阻、电子束及磁控溅射源。溅射系统可以配置成向上或向下溅射的结构。工件台选项包括加热、冷却、偏压和预进样操作等。

系统控制选项包括稳定的PLC真空控制系统配合手动操作的工艺附件的简单模式，或者计算机集成控制的自动模式。

The system design of V TF500 ａnd TF600 has advanced process capability.System configuration can choose a variety of chamber size ａnd process accessories, to accurately meet user needs.Both models can install multiple coating sources ａnd both support ion beam treatment options.A range of Load locks ａnd sample manipulators are available to improve vacuum coating efficiency.

The system is equipped with stainless steel vacuum chamber with high vacuum pump installed at the rear of the chamber.The layout of process accessories adopts special design to provide each customer with satisfactory adaptive scheme.Process accessories include thermal resistance ａnd electron beam evaporation sources, dc ａnd rf sputtering sources, ａnd ion sources for workpiece etching or assisted deposition.The system can be configured with thermal resistance, electron beam ａnd magnetron sputtering source simultaneously.Sputtering systems can be configured to sputter up or down.Worktable options include heating, cooling, biasing, ａnd pre-injection operations.

System control options include a stable PLC vacuum control system with a simple mode of manually operated process accessories, or an automatic mode of computer integrated control.

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