OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes

OAI掩模对准器，不同的印刷方式

距离: 间隙可设置在***个非常宽的范围内，增量精度1µM

软接触: •基材被带入非常柔软的机械接触曝光时的掩模。通过接触力可调软件设置

金属触点: •接触额外的氮气压力

真空接触: •真空***别控制接触力。真空度为由用户设置


OAI Mask Aligners
Various Printing Modes

PROXIMITY: 
• THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN  INCREMENTAL PRECISION OF 1µM 

SOFT CONTACT: 
• SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL CONTACT WITH THE MASK DURING EXPOSURE. THE CONTACT FORCE IS ADJUSTABLE VIA  SOFTWARE SETTINGS

HARD CONTACT:
• CONTACT WITH ADDITIONAL N2 pressure VACUUM CONTACT: 
• VACUUM LEVEL CONTROLS THE CONTACT FORCE. LEVEL OF VACUUM IS SET BY USER

OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes