美***Royce全自动型芯片拾取系统MP300 

适用于2-12英寸晶圆
• *小200微米芯片拾取
• *适合高、中产能，产能可达2000UPH
• 可选配芯片转向功能
• 可输出至2”及4” Tray盘，Wafers, Gel-Pak®, Waffle Pack, 或订制
   Tray
• 采用 Windows XP® 的 DieSort Manager 专业软件
• 放置重复性 +/- 2 mil
• 拾取模式：常规真空表面接触或非表面接触(抓器)
• 10分钟以内快速更换

非表面接触拾取功能

Fully automatic MP300 chip pickup system

Suitable for 2-12 inch wafers

• minimum 200 micron chip pickup

• best for high ａnd medium capacity up to 2000UPH

• optional chip steering function

• export to 2 "and 4" trays, Wafers, gel-pak ®, Waffle Pack, or custom

Tray

• use Windows XP® DieSort Manager professional software

• place repeatability +/- 2 mil

• pickup mode: conventional vacuum surface contact or non-surface contact (gripper)

• quick replacement within 10 minutes

Non-surface contact pickup function