NEW !! AP+ 全自动芯片分选系统

适用芯片尺寸: 托盘放置: 0.2 mm2 - >25 mm2
               载带放置: 0.5 mm2 - 17 mm2
 

输入: 采用载带框或兰膜环，晶圆直径至 Ø300 毫米
 

输出: 载带(宽度8 至 24 毫米，热封或压封)，Waffle packs 及Gel-Paks (2"- 4")，JEDEC盘，载带框，兰膜环或特别定制
 

放置精度: ± 12.5 微米(重复精度)
 

拾取原理: 表面或顶部边缘真空拾取(采用：Rubber, Vespel,Tungsten carbide, elastomer) 可选非表面接触的Vespel edge grip
 

产能: 根据不同产品，*短1.3 秒/循环

Die Pick & Place Systems (Royec)

NEW!!!!!AP+ automatic chip sorting system

Applicable chip size: tray placement: 0.2mm2-> 25mm2

Belt placement: 0.5 mm2 - maximum 17 mm2

Input: the loading box or LAN zona, wafer to Ø 300 mm in diameter

Output: bandages (8 to 24 mm wide, hot or pressed), Waffle packs ａnd gel-paks (2" -4 "), JEDEC disks, bandages, blue film rings or specially tailored

Placement accuracy: ± 12.5 microns (repeat accuracy)

Principle of picking: vacuum pick on surface or top edge (Rubber, Vespel,Tungsten carbide, elastomer) optional non-surface contact Vespel edge grip

Capacity: minimum 1.3 seconds per cycle for different products