适用于6，8英寸晶圆

• *小200微米芯片拾取
• 可选配的非表面接触拾取功能
• Waffle Pak, Gel-Pak® 及 Film Frame 输出
• 可选配背面，侧面检测
• 可选配芯片转向功能
• 根据不同产品，产量可达500-1200 UPH
• 10分钟以内快速更换

拾取大片 GaAs Die

Royec semi-automatic de35-st chip pickup system

Suitable for 6 - ａnd 8-inch wafers

• minimum 200 micron chip pickup

• optional non-surface contact pickup function

• Waffle Pak, gel-pak ® ａnd Film Frame output

• optional back ａnd side inspection

• optional chip steering function

• up to 500-1200 UPH, depending on the product

• quick replacement within 10 minutes

Pick up large pieces of GaAs Die